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DIMOS Ø 150 Diamond Cut-off wheels (Metal Bonded, low conc.)
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Ø 150 mm x 0.5 mm x 12.7 mm dia. Diamond Cut-off wheels For use with hard bri le materials structural ceramics, carbide, boron nitride and silicon carbide.(Metal Bonded, low conc.) 1 pc.
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DIMOS Ø 150 Diamond Cut-off wheels (Metal Bonded, low conc.)
| Weight | 0.65 lbs |
|---|---|
| Dimensions | 9.45 × 9.06 × 0.98 in |
| Diameter | Ø 150 mm |
| Materials | hard brittle materials |
| Volume | 1 pc |
Sectioning can be categorized into two areas: Abrasive Cutting and Precision Wafer Cutting. Abrasive cutting is generally used for metal specimens and is accomplished with silicon carbide or alumina abrasives in resin or resin rubber bonds.
Discover everything you need to know about the Cutting with our comprehensive brochure.
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