19-151

Out of stock

Ø 150 mm x 0.5 mm x 12.7 mm dia. Diamond Cut-off wheels For hard, delicate materials or bri le materials (cannot be used at low speeds. High speed only 950 RPM’s or higher.(Resin Bonded, high conc.) 1 pc.

 

SDS User Guide

  • Estimated delivery time 14-30 days
SKU: 19-151

Product details

DIMOS Ø 150 Diamond Cut-off wheels (Resin Bonded, high conc.)

Additional information

Weight 0.63 lbs
Dimensions 9.45 × 9.06 × 0.98 in
Diameter

Ø 150 mm

Materials

hard, delicate materials or brittle materials

Volume

1 pc

Customers Reviews

There are no reviews yet.

Be the first to review “19-151”

Your email address will not be published. Required fields are marked *

CUTTING EQUIPMENT

Sectioning can be categorized into two areas: Abrasive Cutting and Precision Wafer Cutting. Abrasive cutting is generally used for metal specimens and is accomplished with silicon carbide or alumina abrasives in resin or resin rubber bonds.

APPLICATION NOTE FOR CUTTING

Discover everything you need to know about the Cutting with our comprehensive brochure.

Back to Top
Product has been added to your cart

Please enable JavaScript in your browser to complete this form.

Thank You for Your Interest in Metkon!

To provide you with the most relevant information, please fill out and submit the form below. We will get back to you asap.

Existing Metkon Customer?

* Fields are required

Please enable JavaScript in your browser to complete this form.

Thank You for Your Interest in Metkon!

To provide you with the most relevant information, please fill out and submit the form below. We will get back to you asap.

Existing Metkon Customer?

* Fields are required