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DIMOS Ø 150 Diamond Cut-off wheels (Resin Bonded, high conc.)
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Ø 150 mm x 0.5 mm x 12.7 mm dia. Diamond Cut-off wheels For hard, delicate materials or bri le materials (cannot be used at low speeds. High speed only 950 RPM’s or higher.(Resin Bonded, high conc.) 1 pc.
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DIMOS Ø 150 Diamond Cut-off wheels (Resin Bonded, high conc.)
| Weight | 0.63 lbs |
|---|---|
| Dimensions | 9.45 × 9.06 × 0.98 in |
| Diameter | Ø 150 mm |
| Materials | hard, delicate materials or brittle materials |
| Volume | 1 pc |
Sectioning can be categorized into two areas: Abrasive Cutting and Precision Wafer Cutting. Abrasive cutting is generally used for metal specimens and is accomplished with silicon carbide or alumina abrasives in resin or resin rubber bonds.
Discover everything you need to know about the Cutting with our comprehensive brochure.
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