Diamond Cutting Disc Series Metal Bonded

19-130

Name: 19-130 - Metkon Shop
SKU: 19-130
Price: 396.00 USD
Availability: InStock

1 in stock

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Ø 125 mm x 0.4 mm x 12.7 mm dia.Diamond Cut-off wheels For use with hard bri le materials structural ceramics, boron carbide, boron nitride and silicon carbide. (Metal Bonded, low conc.) 1 pc.

SDS User Guide

Estimated delivery time 14-30 days

SKU: 19-130

Product details

DIMOSØ 125 Diamond Cut-off wheels (Metal Bonded, low conc.)

Additional information

Weight	0.56 lbs
Dimensions	9.45 × 9.06 × 0.98 in
Diameter	Ø 125 mm
Materials	hard brittle materials
Volume	1 pc

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CUTTING EQUIPMENT

Sectioning can be categorized into two areas: Abrasive Cutting and Precision Wafer Cutting. Abrasive cutting is generally used for metal specimens and is accomplished with silicon carbide or alumina abrasives in resin or resin rubber bonds.