19-150

Out of stock

Ø 150 mm x 0.5 mm x 12.7 mm dia. Diamond Cut-off wheels For general use with ferrous and non-ferrous alloys; copper, aluminium, metal matrix composites, PCB boards, thermal spray coatings and titanium alloy. (Metal Bonded, high conc.) 1 pc.

 

SDS User Guide

  • Estimated delivery time 14-30 days
SKU: 19-150

Product details

DIMOS Ø 150 Diamond Cut-off wheels (Metal Bonded, high conc.)

Additional information

Weight 0.64 lbs
Dimensions 9.45 × 9.06 × 0.98 in
Diameter

Ø 150 mm

Materials

ferrous and non-ferrous alloys

Volume

1 pc

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CUTTING EQUIPMENT

Sectioning can be categorized into two areas: Abrasive Cutting and Precision Wafer Cutting. Abrasive cutting is generally used for metal specimens and is accomplished with silicon carbide or alumina abrasives in resin or resin rubber bonds.

APPLICATION NOTE FOR CUTTING

Discover everything you need to know about the Cutting with our comprehensive brochure.

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