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DIMOS Ø 150 Diamond Cut-off wheels (Metal Bonded, high conc.)
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Ø 150 mm x 0.5 mm x 12.7 mm dia. Diamond Cut-off wheels For general use with ferrous and non-ferrous alloys; copper, aluminium, metal matrix composites, PCB boards, thermal spray coatings and titanium alloy. (Metal Bonded, high conc.) 1 pc.
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DIMOS Ø 150 Diamond Cut-off wheels (Metal Bonded, high conc.)
| Weight | 0.64 lbs |
|---|---|
| Dimensions | 9.45 × 9.06 × 0.98 in |
| Diameter | Ø 150 mm |
| Materials | ferrous and non-ferrous alloys |
| Volume | 1 pc |
Sectioning can be categorized into two areas: Abrasive Cutting and Precision Wafer Cutting. Abrasive cutting is generally used for metal specimens and is accomplished with silicon carbide or alumina abrasives in resin or resin rubber bonds.
Discover everything you need to know about the Cutting with our comprehensive brochure.
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